PART |
Description |
Maker |
WBSC0504-22NF-50V |
Wire Bonding Silicon Vertical Capacitor
|
Micross Components
|
M80-5T10805M1-02-331 |
JACKSCREW DATAMATE MIXED TECHNOLOGY PC TAIL MALE ASSEMBLY
|
Harwin Plc
|
M80-5T11205M1-02-331 |
JACKSCREW DATAMATE MIXED TECHNOLOGY PC TAIL MALE ASSEMBLY
|
Harwin Plc
|
KS57P2316 |
Bonding Diagram
|
ETC
|
KS57P2316 |
BONDING DIAGRAM
|
Samsung semiconductor
|
1344171 8663 8663000250 866300050 |
Shielding and Bonding Cable.
|
List of Unclassifed Man...
|
M541 |
Bonding, Handling, and Mounting Procedures for Chip Diode Devices
|
M/A-COM Technology Solutions, Inc.
|
1625-12R-1 |
1.57mm Diameter Standard .062 Pin and Socket Receptacle Housing,12 Circuits, with Mounting Ears, Natural, Glow Wire Technology
|
Molex Electronics Ltd.
|
CY8C2123408 CY8C21334-24PVXIT CY8C21234-24SXI CY8C |
PSoC垄莽 Mixed-Signal Array PSoC庐 Mixed-Signal Array PSoC? Mixed-Signal Array
|
Cypress Semiconductor
|
PIC18F4580 PIC18F2480 PIC18F2480_07 PIC18F2580 PIC |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
SST32HF164-90-4C-L3K SST32HF164-70-4C-L3K SST32HF1 |
PSoC® Mixed-Signal Array Spread Spectrum Clock Generator PSOC POD FOR CY8C21X34 64-Kbit (8K x 8) Static RAM MIXED MEMORY|SRAM EEPROM|CMOS|BGA|48PIN|PLASTIC 混合存储器|静态存储器EEPROM中|的CMOS | BGA封装| 48PIN |塑料
|
Silicon Storage Technology, Inc. Microchip Technology, Inc.
|